Jul 06

The Wall Street Journal reported that Apple has placed orders for key components used in a next-generation iPhone it is preparing to launch sometime in the third quarter, according to people familiar with the situation. According to some suppliers of components to Apple, the new version of the iPhone is expected to be thinner and lighter than the iPhone 4 and sport an 8-megapixel camera.

The next iPhone will reportedly sport new wireless baseband chips from Qualcomm, replacing the Infineon chips found in the current iPhone 4. The report did not indicate whether that wireless chip would be a dual GSM-CDMA model allowing compatibility with both types of networks, something that has previously been rumored for Apples next-generation iPhone.

Apples sales estimates of the new iPhone is quite aggressive. It told us to prepare to help the company meet its goal of 25 million units by the end of the year,” said another person at one of Apple’s suppliers. “The initial production volume will be a few million units… we were told to ship the components to assembler Hon Hai in August.

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